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  • Chip Structure Observation Using Grinding-Polishing Technology JIN Bo (Founder Micro such as IC production, process optimization, failure analyses and product reliability. Chip
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  • 3. National Engineering Research Center for High Efficiency Grinding , Hunan U niv, Cha IC. 0 | : zzx67abc 2014-04-17 07:50| :| :txt 2
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  • Based on analysis of Chemo-mechanical-grinding(CMG) technology with Soft Abrasive Anhui University of Technology,Maanshan 243002,China;2.Center of Advanced Materia
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  • The advances of surface grinding technology and grinder of silicon wafers were introduc grinding technologies,i.e.,rotary table grinding,wafer rotation grinding,and double-side g
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  • The Trends and the State of Grinding Technology and Polishing Productionsin IC Manufacturing : ,
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  • Shenzhen Xin Feng Source Laser Technology Co., Ltd., Professional processing of electronic components IC, chip, FLASH, BGA, RAM, SOP series, DIP series, QFN package
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  • Grinding Technology (I) Theoretical Generalization and Research on Grinding Mechanis IC
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  • The grinding technology of silicon wafer assisted by ELID is discussed and several manufacturing technologies of new-style grinding discs for solving the inhomogeneous aggrega
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  • of a novel binderless diamond grinding wheel for machining IC chips for failure analysis. International Journal of Advanced Manufacturing Technology 01/2012; 58(9-12):949-967
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  • Vitrified bond Diamond Centerless Grinding Wheel for Precision Grinding the Cylinder o tech electronic parts and related products such as magic head, IC, LSI, .2012-11-06
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  • Circuit Co., Ltd. Shenzhen TW, Reverse research components: semiconductor material resolved, refurbished components, connectors, relays, transistor, integrated circuit IC,
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  • Research on New Centerless Grinding Technique and Its Appliion for Microscale Par A new centreless grinding technique was proposed for the process of microscale parts.
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  • grinding wheels are mainly applied to ultra-precision back grinding for IC silicon wafer.T features and appliions of the wheel grinding technology were introduced,the experime
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  • precision engineering,ic tube design and manufacture,surface grind grinding lenght max. 2000mm width 1400mm, cylindrical grind max. OD 1250mm lenght 1000mm, profile
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  • Chip Structure Observation Using Grinding-Polishing Technology JIN Bo (Founder Micro such as IC production, process optimization, failure analyses and product reliability. Chip
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  • Chip Structure Observation Using Grinding-Polishing Technology JIN Bo (Founder Micro such as IC production, process optimization, failure analyses and product reliability. Chip
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  • Chip Structure Observation Using Grinding-Polishing Technology JIN Bo (Founder Micro such as IC production, process optimization, failure analyses and product reliability. Chip
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